Laboratory Technician Cookson Semiconductor Packaging Materials

Posted in on Laboratory, Life Sciences at 23 Feb, 2010

Job Responsibilities & Requirements:

  • ITE NITEC/Higher NITEC/Polytechnic Diploma or equivalent.
  • Some relevant experience in semiconductor EOL/FOL, e.g. wafer sawing, die bonding/attachment, wire bonding, molding and testing
  • Some relevant experience with material characterization and analytical works is preferred, e.g. FTIR, TGA, TMA, DSC, CSEM, X-Ray, PSD.
  • Ability to work rotating 3 shifts.
  • Experience is semiconductor electrical test and failure analysis is highly preferred.

Benefits:

  • Shift and Overtime Allowances
  • Annual Leave up to 20 days
  • Medical Insurance (Outpatient and Inpatient)
  • Dental Reimbursement
  • Company transport from designated pick-up points.

Qualified and interested candidates should forward their resumes indicating their career history, qualifications, current and expected salary to: hrcspm@cooksonelectronics.com

Cookson Electronics – Semiconductor Products is a U.S. MNC engaged in the semiconductor industry. In support of our vision of being the preferred partner and supplier to the leading semiconductor packaging manufacturers for innovative materials solutions, we invite suitably qualified candidate to join us as to be based in our Singapore subsidiary – .

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Job Responsibilities & Requirements: ITE NITEC/Higher NITEC/Polytechnic Diploma or equivalent. Some relevant experience in semiconductor EOL/FOL, e.g. wafer sawing, die bonding/attachment, wire bonding, molding and testing Some relevant experience with material characterization and analytical works is preferred, e.g. FTIR, TGA, TMA, DSC, CSEM, X-Ray, PSD. Ability to work rotating 3 shifts. Experience is semiconductor electrical [...]

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